TCM-1280SWIR-USB3
1.3 million pixel SWIR band InGaAs infrared camera
High infrared sensitivity and low noise.
Application: semiconductor wafer inspection, security equipment.
Wavelength: 400~1700nm
Interface : Camera Link、USB3.0
Active Pixels : 1280(H) x 1024(V)
Active Image Size : 12.8(H) x 10.24(V)
Pixel Size (μm) : 10(H) x 10(V)
Lens Mount : C-Mount
Frame Rate : 30fps
Dimension (mm) : 61.5(W) x 71.6(H)x 59.0(L)
TCM-1280SWIR-UB3 is InGaAS camera for SWIR band with high sensitivity photosynthel, high resolution, high definition, high precision, low noise and other characteristics.
Penetration plastic detection
Semiconductor wafer detection
Optical communication element detection
Wavelength graph